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In Situ Young's Modulus and Strain-Rate
Sensitivity of Lead-Free SAC 105 Solder
Application Note
Abstract indentation to measure the in situ Young's time that the indenter is in contact with
modulus and strain-rate sensitivity of a the material. Nearly all of the advantages
Motivated by our desire to understand common lead-free solder alloy known as of instrumented indentation derive from
and improve the mechanical reliability SAC 105, which by weight is predomi- this continuous measurement of force
of solder joints in integrated circuits, nantly tin (Sn) alloyed with 1% silver (Ag) and displacement. In 1992, Oliver and
we used instrumented indentation to and 0.5% copper (Cu). Pharr proposed an analytic method by
measure the Young's modulus (E) and which contact area could be calculated
strain-rate sensitivity (m) of a common Since SAC 105 is predominantly (98.5%) from the force-displacement data, thus
tin, it is appropriate and helpful to eliminating the need to image the residual
lead-free solder alloy, SAC 105 (98.5%
compare our results to those measured impression when determining hardness
Sn, 1% Ag, 0.5% Cu). Measured values
by others for unalloyed tin. The nomi- (H) as the indentation force divided by
(E = 49.1